I hope you found this introduction to Thermal Studies helpful. Edit the definition of the Thermal 1 results, and under Plot Steps, change the Plot Step to 30, which will show the results after 300 seconds.
To take a look at the results at the different increments:.The results that initially show, are for Plot Step 1, which is only 10 seconds into the study. Set the Temperature to be 25 Celcius (✬).Select all the different parts from the FeatureManager fly out tree.Right-click on Thermal Loads and add a Temperature.The next step is to add an Initial Temperature.Under Options, select Transient and set the Total time to 300 s, at a time increment of 10 s.Right-click on the study name from the tree and select Properties.In this example, we mainly need to change the properties.So, to start, we will copy the Steady-State study. (The article Time-based Thermal Stress in SOLIDWORKS Simulation goes into even more detail). This example is a time-dependent thermal analysis study, to understand how quickly this will heat and/or cool. We can now run the study and analyze the results.Convection Coefficient is 100 W/(m^2.K), Bulk Ambient Temperature is 300 Kelvin (K).Accept that, and start a new Convection for the exposed faces of the microchip.Define Bulk Ambient Temperature (the temperature that surrounds the model) as 300 Kelvin (K).Define the Convection Coefficient as 250 W/(m^2.K).Select all the exposed faces of the heat sink.Right-click on Thermal Loads and select Convection.Because the connectors are insulated, we don’t need to define those. We now need to define the convection that is coming off of the rest of the faces on the heat sink.Define the contact based on the conductive glue 2.857e-6 K/W.Click the two faces that touch between the microchip and heat sink.Create a Local Interaction, and make sure it is set to Thermal Resistance.The glue is not physically modeled, we are going to insert it as a contact resistance. Between our microchip and heat sink, we have a thermal conductive glue to help with the dissipation. Next, we need to consider how this heat is going to be dissipated.Use the FeatureManager flyout tree to select the microchip part.Right-click on Thermal Loads, and select Heat Power.Then we are going to define the heat power of the microchip.We will start by creating a new Thermal Study.Connectors – Insulated and used to connect to the rest of the electronic components.įor this example, we will be setting it up as a steady-state thermal analysis, which means there is no time factor involved.Our model will consist of a few different parts:
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